For Reference Only
| Part Number | XCZU7EG-3FBVB900E |
| Manufacturer | AMD Xilinx |
| Category | Integrated Circuits (ICs) › System On Chip (SoC) |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | XCZU7EG-3FBVB900E PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Dec 05 - Dec 09 2024(Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment | 
|
| Shipping |  |
| Part Number: | XCZU7EG-3FBVB900E |
| Brand: | AMD Xilinx |
| Lifecycle: | Active |
| RoHS: | Lead free / RoHS Compliant |
| Category: | Integrated Circuits (ICs) |
| Subcategory: | System On Chip (SoC) |
| Manufacturer: | AMD Xilinx |
| Product Status: | Active |
| Architecture: | MCU, FPGA |
| Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size: | - |
| RAM Size: | 256KB |
| Peripherals: | DMA, WDT |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed: | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature: | 0°C ~ 100°C (TJ) |
| Package / Case: | 900-BBGA, FCBGA |
| Supplier Device Package: | 900-FCBGA (31x31) |
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| In Stock | 21 pieces - More on Order |
|---|---|
| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
Warm Tips: Please fill out the form below. We will contact you as soon as possible.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1 | $4,113.12000 | $4 |
Due to the impact of the COVID-19,the above prices have not been updated, please resend the inquiry to us, thank you for your understanding
Please feel free to contact us for details.
